Compound Chip

Features

  • High electrical conductivity; superior electrostatic dispersion and electromagnetic shielding
  • Good dispersibility; easy to attain electrical conductivity after injection molding
  • Excellent heat conductivity properties; can be applied for heat protection materials

Uses

  • Automated banking devices, like BRM, CDU, BNA, BCA, bankbook organizer
  • Packing and transport container for semiconductors like IC trays, carriers, cassettes
  • Automotive applications: fenders, mirror housing, fuel lines
  • Heat protection for LED, PDP

Chief representatives

  • Market Development Team
  • Byung Joon Han
  • TEL: 82-2-2146-5457
  • FAX: 82-2-2146-5428 
  • INQUIRY

* These are the numbers for those responsible for each of the business areas.

 
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Contact Target : Power&Industrial System / Power System PU

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