Silicon ingots are cut with fine sawing wires to make silicon wafers.
These silicon wafers are largely comprised of two groups – i.e. wafers for solar cells and wafers for semiconductors.
Sawing wires of 0.12 mm are needed for the production of solar cell wafers and 0.14 mm for semiconductor wafers – and the wires are getting smaller in diameter to increase overall wafer productivity.
Higher wafer production yield for customers with low wire-breakage rates
Precise and uniform property for a smoother wafer surface
Sawing wire for wafer production
Production of wafers for solar cells
Production of wafers for semiconductors
SW Sales Team
* These are the numbers for those responsible for each of the business areas.